Semiconductor device and method for fabricating the same

ABSTRACT

The present application discloses a method for fabricating a semiconductor device. The method for fabricating a semiconductor device includes providing a substrate comprising a center area and a peripheral area surrounding the center area, forming a first gate stack on the peripheral area and having a top surface, and forming an active column in the center area and having a top surface at a same vertical level as the top surface of the first gate stack.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a divisional application of U.S. Non-Provisionalapplication Ser. No. 16/702,884 filed Dec. 4, 2019, which isincorporated herein by reference in its entirety.

TECHNICAL FIELD

The present disclosure relates to a method for fabricating asemiconductor device, and more particularly, to a method for fabricatinga semiconductor device with a flat surface.

DISCUSSION OF THE BACKGROUND

Semiconductor devices are used in a variety of electronic applications,such as personal computers, cellular telephones, digital cameras, andother electronic equipment. The dimensions of semiconductor devices arecontinuously being scaled down to meet the increasing demand ofcomputing ability. However, a variety of issues arise during thescaling-down process, and such issues are continuously increasing infrequency and impact. Therefore, challenges remain in achieving improvedquality, yield, performance, and reliability and reduced complexity.

This Discussion of the Background section is provided for backgroundinformation only. The statements in this Discussion of the Backgroundare not an admission that the subject matter disclosed in this sectionconstitutes prior art to the present disclosure, and no part of thisDiscussion of the Background section may be used as an admission thatany part of this application, including this Discussion of theBackground section, constitutes prior art to the present disclosure.

SUMMARY

One aspect of the present disclosure provides a semiconductor devicecomprising a substrate including a center area and a peripheral areasurrounding the center area, a first gate stack positioned on theperipheral area of the substrate, and an active column positioned in thecenter area of the substrate. A top surface of the first gate stack anda top surface of the active column are at a same vertical level.

Another aspect of the present disclosure provides a method forfabricating a semiconductor device, including providing a substratecomprising a center area and a peripheral area surrounding the centerarea, forming a first gate stack on the peripheral area and having a topsurface, and forming an active column in the center area and having atop surface at a same vertical level as the top surface of the firstgate stack.

Due to the design of the semiconductor device of the present disclosure,the semiconductor device may have a substantially flat top surface. Thesubstantially flat top surface facilitates subsequent semiconductorprocesses. Therefore, the yield and quality of the semiconductor devicemay be improved. In addition, the presence of a plurality of air gapsmay significantly alleviate an interference effect originating from aparasitic capacitance. Furthermore, the presence of a plurality ofepitaxial units may improve a carrier mobility of the semiconductordevice.

The foregoing has outlined rather broadly the features and technicaladvantages of the present disclosure in order that the detaileddescription of the disclosure that follows may be better understood.Additional features and advantages of the disclosure will be describedhereinafter, and form the subject of the claims of the disclosure. Itshould be appreciated by those skilled in the art that the conceptionand specific embodiment disclosed may be readily utilized as a basis formodifying or designing other structures or processes for carrying outthe same purposes of the present disclosure. It should also be realizedby those skilled in the art that such equivalent constructions do notdepart from the spirit and scope of the disclosure as set forth in theappended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It shouldbe noted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 illustrates, in a schematic top-view diagram, a semiconductordevice in accordance with one embodiment of the present disclosure;

FIG. 2 is a schematic cross-sectional view diagram taken along a lineA-A′ in FIG. 1;

FIG. 3 is a schematic cross-sectional view diagram taken along a lineB-B′ in FIG. 1;

FIG. 4 is a schematic cross-sectional view diagram taken along a lineC-C′ in FIG. 1;

FIG. 5 is a schematic cross-sectional view diagram taken along the lineA-A′ in FIG. 1 illustrating a semiconductor device in accordance withanother embodiment of the present disclosure;

FIG. 6 is a schematic cross-sectional view diagram taken along the lineC-C′ in FIG. 1 illustrating the semiconductor device in accordance withanother embodiment of the present disclosure;

FIG. 7 is a schematic cross-sectional view diagram taken along the lineA-A′ in FIG. 1 illustrating a semiconductor device in accordance withanother embodiment of the present disclosure;

FIG. 8 illustrates, in a flowchart diagram form, a method forfabricating a semiconductor device in accordance with one embodiment ofthe present disclosure;

FIG. 9 illustrates, in a schematic top-view diagram, an intermediatesemiconductor device in accordance with one embodiment of the presentdisclosure;

FIGS. 10 to 18 are schematic cross-sectional view diagrams taken alongthe line A-A′ in FIG. 9 illustrating part of a flow for fabricating thesemiconductor device in accordance with one embodiment of the presentdisclosure;

FIG. 19 illustrates, in a schematic top-view diagram, an intermediatesemiconductor device in accordance with one embodiment of the presentdisclosure;

FIGS. 20 to 25 are schematic cross-sectional view diagrams taken along aline A-A′ in FIG. 19 illustrating part of the flow for fabricating thesemiconductor device in accordance with one embodiment of the presentdisclosure;

FIG. 26 illustrates, in a schematic top-view diagram, an intermediatesemiconductor device in accordance with one embodiment of the presentdisclosure;

FIG. 27 is a schematic cross-sectional view diagram taken along a lineA-A′ in FIG. 26 illustrating part of the flow for fabricating thesemiconductor device in accordance with one embodiment of the presentdisclosure;

FIG. 28 is a schematic cross-sectional view diagram taken along a lineB-B′ in FIG. 26 illustrating part of the flow for fabricating thesemiconductor device in accordance with one embodiment of the presentdisclosure;

FIG. 29 is a schematic cross-sectional view diagram taken along the lineA-A′ in FIG. 26 illustrating part of the flow for fabricating thesemiconductor device in accordance with one embodiment of the presentdisclosure;

FIG. 30 is a schematic cross-sectional view diagram taken along the lineB-B′ in FIG. 26 illustrating part of the flow for fabricating thesemiconductor device in accordance with one embodiment of the presentdisclosure;

FIG. 31 is a schematic cross-sectional view diagram taken along the lineA-A′ in FIG. 26 illustrating part of the flow for fabricating thesemiconductor device in accordance with one embodiment of the presentdisclosure;

FIG. 32 is a schematic cross-sectional view diagram taken along the lineB-B′ in FIG. 26 illustrating part of the flow for fabricating thesemiconductor device in accordance with one embodiment of the presentdisclosure;

FIG. 33 is a schematic cross-sectional view diagram taken along the lineA-A′ in FIG. 26 illustrating part of the flow for fabricating thesemiconductor device in accordance with one embodiment of the presentdisclosure;

FIG. 34 is a schematic cross-sectional view diagram taken along the lineB-B′ in FIG. 26 illustrating part of the flow for fabricating thesemiconductor device in accordance with one embodiment of the presentdisclosure;

FIG. 35 illustrates, in a schematic top-view diagram, an intermediatesemiconductor device in accordance with one embodiment of the presentdisclosure;

FIGS. 36 and 37 are schematic cross-sectional view diagrams taken alonga line A-A′ in FIG. 35 illustrating part of the flow for fabricating thesemiconductor device in accordance with one embodiment of the presentdisclosure;

FIG. 38 illustrates, in a schematic top-view diagram, an intermediatesemiconductor device in accordance with one embodiment of the presentdisclosure;

FIGS. 39 and 40 are schematic cross-sectional view diagrams taken alonga line A-A′ in FIG. 38 illustrating part of the flow for fabricating thesemiconductor device in accordance with one embodiment of the presentdisclosure.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

It should be understood that when an element or layer is referred to asbeing “connected to” or “coupled to” another element or layer, it can bedirectly connected to or coupled to another element or layer, orintervening elements or layers may be present.

It should be understood that, although the terms first, second, etc. maybe used herein to describe various elements, these elements should notbe limited by these terms. Unless indicated otherwise, these terms areonly used to distinguish one element from another element. Thus, forexample, a first element, a first component or a first section discussedbelow could be termed a second element, a second component or a secondsection without departing from the teachings of the present disclosure.

Unless the context indicates otherwise, terms such as “same,” “equal,”“planar,” or “coplanar,” as used herein when referring to orientation,layout, location, shapes, sizes, amounts, or other measures, do notnecessarily mean an exactly identical orientation, layout, location,shape, size, amount, or other measure, but are intended to encompassnearly identical orientation, layout, location, shapes, sizes, amounts,or other measures within acceptable variations that may occur, forexample, due to manufacturing processes. The term “substantially” may beused herein to reflect this meaning. For example, items described as“substantially the same,” “substantially equal,” or “substantiallyplanar,” may be exactly the same, equal, or planar, or may be the same,equal, or planar within acceptable variations that may occur, forexample, due to manufacturing processes.

In the present disclosure, a semiconductor device generally means adevice which can function by utilizing semiconductor characteristics,and an electro-optic device, a light-emitting display device, a memorydevice, a semiconductor circuit, and an electronic device are allincluded in the category of the semiconductor device.

It should be noted that, in the description of the present disclosure,above (or up) corresponds to the direction of the arrow of the directionZ, and below (or down) corresponds to the opposite direction of thearrow of the direction Z.

FIG. 1 illustrates, in a schematic top-view diagram, a semiconductordevice 100A in accordance with one embodiment of the present disclosure.FIG. 2 is a schematic cross-sectional view diagram taken along a lineA-A′ in FIG. 1. FIG. 3 is a schematic cross-sectional view diagram takenalong a line B-B′ in FIG. 1. FIG. 4 is a schematic cross-sectional viewdiagram taken along a line C-C′ in FIG. 1. Some elements of thesemiconductor device 100A of the present disclosure are not shown inFIG. 1 for clarity.

With reference to FIGS. 1 to 4, in the embodiment depicted, thesemiconductor device 100A may include a substrate 101, an isolationlayer 103, a first gate stack 201, a pair of first gate spacers 211, apair of first gate lightly-doped regions 213, a pair of first gateheavily-doped regions 215, a second gate stack 301, a pair of secondgate spacers 313, a pair of second gate lightly-doped regions 315, apair of second gate heavily-doped regions 317, a plurality of activecolumns 401, a plurality of bit lines 501, a plurality of word lines601, a first insulating layer 701, a second insulating layer 703, athird insulating layer 705, a fourth insulating layer 707, a pluralityof bit line contacts 709, and a plurality of capacitor contacts 711.

With reference to FIGS. 1 to 4, in the embodiment depicted, thesubstrate 101 may include a center area 10 and a peripheral area 20. Theperipheral area 20 may surround the center area 10. The substrate 101may be formed of, for example, silicon, germanium, silicon germanium,silicon carbon, silicon germanium carbon, gallium, gallium arsenic,indium arsenic, indium phosphorus or other IV-IV, III-V or II-VIsemiconductor material.

It should be noted that the center area 10 may comprise a portion of thesubstrate 101 and a space above the portion of the substrate 101. From across-sectional view perspective, describing an element as beingdisposed on the center area 10 means that the element is disposed on atop surface of the portion of the substrate 101. Describing an elementas being disposed in the center area 10 means that the element isdisposed in the portion of the substrate 101; however, a top surface ofthe element may be even with the top surface of the portion of thesubstrate 101. Describing an element as being disposed above the centerarea 10 means that the element is disposed above the top surface of theportion of the substrate 101. From a top-view perspective, describing anelement as being disposed in the center area 10 means that the elementis disposed within a boundary of the center area 10. The element may bedisposed in the portion of the substrate 101, on the top surface of theportion of the substrate 101, or above the top surface of the portion ofthe substrate 101. Accordingly, the peripheral area 20 may compriseanother portion of the substrate 101 and a space above the other portionof the substrate 101.

With reference to FIGS. 1 and 2, in the embodiment depicted, theisolation layer 103 may be disposed in the substrate 101. The isolationlayer 103 may be formed of, for example, an insulating material such assilicon oxide, silicon nitride, silicon oxynitride, silicon nitrideoxide, or fluoride-doped silicate. The isolation layer 103 may define afirst active area 105 and a second active area 107. The first activearea 105 and the second active area 107 may be disposed in theperipheral area 20. The second active area 107 may be disposed next tothe first active area 105, but is not limited thereto.

With reference to FIGS. 1 and 2, in the embodiment depicted, the firstgate stack 201 and the second gate stack 301 may be disposed on a topsurface 101-1 of the substrate 101. Specifically, the first gate stack201 and the second gate stack 301 may be disposed on the peripheral area20. The first gate stack 201 may intersect a portion of the first activearea 105 from a top-view perspective. In other words, the first gatestack 201 may be disposed on the first active area 105. The second gatestack 301 may intersect a portion of the second active area 107 from atop-view perspective. In other words, the second gate stack 301 may bedisposed on the second active area 107. The first gate stack 201 mayhave a top surface at a same vertical level as a top surface of thesecond gate stack 301.

With reference to FIGS. 1 and 2, in the embodiment depicted, the firstgate stack 201 may include a first gate insulating layer 203, a firstgate bottom conductive layer 205, a first gate filler layer 207, and afirst gate mask layer 209. The first gate insulating layer 203 may bedisposed on the peripheral area 20 and on the first active area 105. Thefirst gate insulating layer 203 may have a thickness between about 0.5nm and about 5.0 nm. Preferably, the thickness of the first gateinsulating layer 203 may be between about 0.5 nm and about 2.5 nm.

The first gate insulating layer 203 may be formed of, for example, aninsulating material having a dielectric constant of about 4.0 orgreater. (All dielectric constants mentioned herein are relative to avacuum unless otherwise noted.) The insulating material having adielectric constant of about 4.0 or greater may be hafnium oxide,hafnium zirconium oxide, hafnium lanthanum oxide, hafnium silicon oxide,hafnium tantalum oxide, hafnium titanium oxide, zirconium oxide,aluminum oxide, aluminum silicon oxide, titanium oxide, tantalumpentoxide, lanthanum oxide, lanthanum silicon oxide, strontium titanate,lanthanum aluminate, yttrium oxide, gallium (III) trioxide, gadoliniumgallium oxide, lead zirconium titanate, barium titanate, bariumstrontium titanate, barium zirconate, or a mixture thereof.Alternatively, in another embodiment, the insulating material may besilicon oxide, silicon nitride, silicon oxynitride, silicon nitrideoxide, or the like.

With reference to FIGS. 1 and 2, in the embodiment depicted, the firstgate bottom conductive layer 205 may be disposed on the first gateinsulating layer 203. The first gate bottom conductive layer 205 mayhave a thickness between about 10 angstroms and about 200 angstroms.Preferably, the thickness of the first gate bottom conductive layer 205may be between about 10 angstroms and about 100 angstroms. The firstgate bottom conductive layer 205 may be formed of, for example,aluminum, silver, titanium, titanium nitride, titanium aluminum,titanium carbide aluminum, titanium nitride aluminum, titanium siliconaluminum, tantalum nitride, tantalum carbide, tantalum silicon nitride,manganese, zirconium, or tungsten nitride. The first gate filler layer207 may be disposed on the first gate bottom conductive layer 205. Thefirst gate filler layer 207 may be formed of, for example, tungsten oraluminum. The first gate mask layer 209 may be disposed on the firstgate filler layer 207 and may be formed of, for example, silicon oxide,silicon nitride, silicon oxynitride, or silicon nitride oxide.

With reference to FIGS. 1 and 2, in the embodiment depicted, the pair offirst gate spacers 211 may be disposed on the substrate 101 andrespectively correspondingly disposed adjacent to two sides of the firstgate stack 201. The pair of first gate spacers 211 may be formed of, forexample, silicon oxide, silicon nitride, silicon oxynitride, or siliconnitride oxide. The pair of first gate lightly-doped regions 213 may bedisposed in the first active area 105 and respectively correspondinglydisposed adjacent to two sides of the first gate insulating layer 203.The pair of first gate heavily-doped regions 215 may be disposed in thefirst active area 105 and respectively correspondingly disposed next tothe pair of first gate lightly-doped regions 213. The pair of first gatelightly-doped regions 213 and the pair of first gate heavily-dopedregions 215 may be doped with a dopant such as phosphorus, arsenic, orantimony and have a first electrical type. The pair of first gateheavily-doped regions 215 may have a dopant concentration greater than adopant concentration of the pair of first gate lightly-doped regions213.

With reference to FIGS. 1 and 2, in the embodiment depicted, the secondgate stack 301 may include a second gate insulating layer 303, a secondgate bottom conductive layer 305, a second gate top conductive layer307, a second gate filler layer 309, and a second gate mask layer 311.The second gate insulating layer 303 may be disposed on the peripheralarea 20 and on the second active area 107. The second gate insulatinglayer 303 may have a same thickness as the first gate insulating layer203. Alternatively, in another embodiment, the second gate insulatinglayer 303 may have a thickness different from the first gate insulatinglayer 203. The second gate insulating layer 303 may be formed of a samematerial as the first gate insulating layer 203, but is not limitedthereto.

With reference to FIGS. 1 and 2, in the embodiment depicted, the secondgate bottom conductive layer 305 may be disposed on the second gateinsulating layer 303. The second gate bottom conductive layer 305 mayhave a thickness between about 10 angstroms and about 100 angstroms. Thesecond gate bottom conductive layer 305 may be formed of, for example,titanium nitride, tantalum nitride, tantalum carbide, tungsten nitride,or ruthenium. The second gate top conductive layer 307 may be disposedon the second gate bottom conductive layer 305. The second gate topconductive layer 307 may have a same thickness as the first gate bottomconductive layer 205, but is not limited thereto. The second gate topconductive layer 307 may be formed of a same material as the first gatebottom conductive layer 205, but is not limited thereto.

With reference to FIGS. 1 and 2, in the embodiment depicted, the secondgate filler layer 309 may be disposed on the second gate top conductivelayer 307. The second gate filler layer 309 may have a same thickness asthe first gate filler layer 207, but is not limited thereto. The secondgate filler layer 309 may be formed of a same material as the first gatefiller layer 207, but is not limited thereto. The second gate mask layer311 may be disposed on the second gate filler layer 309. The second gatemask layer 311 may be formed of a same material as the first gate masklayer 209, but is not limited thereto. A top surface 311-1 of the secondgate mask layer 311 may be at a same vertical level as a top surface209-1 of the first gate mask layer 209.

With reference to FIGS. 1 and 2, in the embodiment depicted, the pair ofsecond gate spacers 313 may be disposed on the substrate 101 andrespectively correspondingly disposed adjacent to two sides of thesecond gate stack 301. The pair of second gate spacers 313 may be formedof a same material as the pair of first gate spacers 211, but are notlimited thereto. The pair of second gate lightly-doped regions 315 maybe disposed in the second active area 107 and respectivelycorrespondingly disposed adjacent to two sides of the second gateinsulating layer 303. The pair of second gate heavily-doped regions 317may be disposed in the second active area 107 and respectivelycorrespondingly disposed next to the pair of second gate lightly-dopedregions 315. The pair of second gate lightly-doped regions 315 and thepair of second gate heavily-doped regions 317 may be doped with a dopantsuch as boron and have a second electrical type. The pair of second gateheavily-doped regions 317 may have a dopant concentration greater than adopant concentration of the pair of second gate lightly-doped regions315.

The different thicknesses of the second gate insulating layer 303 andthe first gate insulating layer 203 may result in different thresholdvoltages for the second gate stack 301 and the first gate stack 201. Asa result, the first gate stack 201 and the second gate stack 301 mayprovide different purposes or functions. Therefore, the applicability ofthe semiconductor device 100A may be increased.

With reference to FIGS. 1 and 2, in the embodiment depicted, the firstinsulating layer 701 may be disposed on the top surface 101-1 of thesubstrate 101. Specifically, a main portion of the first insulatinglayer 701 may be disposed on the peripheral area 20. A minor portion ofthe first insulating layer 701 may be disposed on an edge of the centerarea 10. The first insulating layer 701 may cover the first gate stack201 and the second gate stack 301. A top surface of the first insulatinglayer 701 may be at a same vertical level as the top surfaces of thefirst gate stack 201 and the second gate stack 301. The first insulatinglayer 701 may be formed of, for example, silicon oxide, flowable oxide,undoped silica glass, borosilica glass, phosphosilica glass,borophosphosilica glass, fluoride silicate glass, carbon-doped siliconoxide, organo silicate glass, or a combination thereof, but is notlimited thereto.

With reference to FIG. 1, in the embodiment depicted, from a top-viewperspective, the plurality of active columns 401 may be disposed in thecenter area 10 and each of the plurality of active columns 401 may havea rectangular shape. The plurality of active columns 401 may beseparated from each other and may be respectively disposed along adirection X and a direction Y. Distances between adjacent pairs of theactive columns 401 along the direction X or the direction Y may be thesame.

With reference to FIG. 2, in the embodiment depicted, from across-sectional view perspective, the plurality of active columns 401may be columns extending in the direction Z. Any one of the plurality ofactive columns 401 may include a lower portion and an upper portion. Thelower portion of the active column 401 may be disposed in the substrate101. The upper portion of the active column 401 may be disposed on thesubstrate 101. Top surfaces of the plurality of active columns 401 maybe at a same vertical level as the top surfaces of the first gate stack201 and the second gate stack 301.

With reference to FIG. 2, in the embodiment depicted, the active columns401 may include a bottom doped region 403, a channel region 405, a topdoped region 407, and a pair of insulating spacers 409. The bottom dopedregion 403 may be regarded as the lower portion of the active column401. The channel region 405 and the top doped region 407 may be regardedas the upper portion of the active column 401. The bottom doped region403 may be disposed in the center area 10. A top surface of the bottomdoped region 403 may be at a same vertical level as the top surface101-1 of the substrate 101. The bottom doped region 403 may be formedof, for example, doped silicon or epitaxy growth silicon with in-situdoping. The bottom doped region 403 may be doped with a dopant such asphosphorus, arsenic, or antimony and may have the first electrical type.A lower portion and an upper portion of the bottom doped region 403 mayhave a same dopant concentration. Alternatively, in another embodiment,the bottom doped region 403 may have a dopant concentration gradient.For example, the dopant concentration of the lower portion of the bottomdoped region 403 may be greater than the dopant concentration of theupper portion of the bottom doped region 403.

With reference to FIG. 2, in the embodiment depicted, the channel region405 may be disposed on the bottom doped region 403. A bottom of thechannel region 405 may be at a same vertical level as the top surface101-1 of the substrate 101. The channel region 405 may be formed of, forexample, doped silicon or epitaxy growth silicon with in-situ doping.The channel region 405 may be doped with a dopant such as boron and mayhave the second electrical type. The top doped region 407 may bedisposed on the channel region 405. A top surface 407-1 of the top dopedregion 407 may be at a same vertical level as the top surface 209-1 ofthe first gate mask layer 209 and the top surface 311-1 of the secondgate mask layer 311. The top doped region 407 may be formed of, forexample, doped silicon or epitaxy growth silicon with in-situ doping.The top doped region 407 may be doped with a dopant such as phosphorus,arsenic, or antimony and may have the first electrical type.Alternatively, in another embodiment, the bottom doped region 403 andthe top doped region 407 may have the second electrical type, and thechannel region 405 may have the first electrical type.

With reference to FIGS. 1 to 3, in the embodiment depicted, the pairs ofinsulating spacers 409 may be attached to two sides of the active column401. It should be noted that the insulating spacers 409 are attachedonly to the sides of the active column 401 that are parallel to thedirection Y. Sidewalls parallel to the direction Y of the top dopedregion 407, the channel region 405, and the bottom doped region 403together form the sides parallel to the direction Y of the active column401. Top surfaces of the pair of insulating spacers 409 may be at a samelevel as the top surface 407-1 of the top doped region 407. Bottoms ofthe pair of insulating spacers 409 may be at a vertical level lower thanthe vertical level of the top surface of the bottom doped region 403. Inother words, the pair of insulating spacers 409 may cover the wholesidewalls, which are parallel to the direction Y, of the top dopedregion 407 and upper portions of the sidewalls, which are parallel tothe direction Y, of the bottom doped region 403. The pair of insulatingspacers 409 may be formed of, for example, silicon oxide, siliconnitride, silicon oxynitride, silicon nitride oxide, or the like.

With reference to FIGS. 1 to 3, in the embodiment depicted, theplurality of bit lines 501 may be disposed adjacent to the sides, whichare parallel to the direction Y, of the plurality of active columns 401.Specifically, any of the plurality of bit lines 501 may include aconnection portion 503, an extending portion 505, and an adhesion layer507. The connection portion 503 may extend in the direction Y and havetwo ends from a top-view perspective. The connection portion 503 may bedisposed adjacent to the sidewall, which is parallel to the direction Y,of the bottom doped region 403. A portion of the connection portion 503may be disposed in a recessed portion of the sidewall of the bottomdoped region 403 and may be disposed below one of the pair of insulatingspacers 409. The connection portion 503 may electrically connect to theplurality of active columns 401 along the direction Y through the bottomdoped region 403.

With reference to FIGS. 1 and 2, in the embodiment depicted, theextending portion 505 may be connected to one of the two ends of theconnection portion 503 and may extend in the direction Z. A top surfaceof the extending portion 505 may be at a same vertical level as the topsurface 407-1 of the top doped region 407. The connection portion 503and the extending portion 505 may be formed of, for example, tungsten,aluminum, copper, nickel, or cobalt. With reference to FIGS. 1 to 3, inthe embodiment depicted, the adhesion layer 507 may be disposed betweenthe bottom doped region 403 and the connection portion 503. The adhesionlayer 507 may be formed of, for example, titanium, titanium nitride,tantalum nitride, ruthenium, tungsten, or tungsten nitride. The presenceof the adhesion layer 507 may provide improved adhesion and reducedelectrical resistance between the connection portion 503 and the bottomdoped region 403.

With reference to FIGS. 1 to 3, in the embodiment depicted, the secondinsulating layer 703 may be parallel to the direction Y and disposedbetween the plurality of bit lines 501. The second insulating layer 703may disposed between the plurality of active columns 401. A top surfaceof the second insulating layer 703 may be at a same vertical level asthe vertical level of the top surface of the first insulating layer 701.Bottoms of the second insulating layer 703 may be at a vertical levellower than a vertical level of the bottom of the bottom doped region403. The second insulating layer 703 may be formed of a same material asthe first insulating layer 701, but is not limited thereto.

With reference to FIGS. 1 and 4, in the embodiment depicted, theplurality of word lines 601 may extend in a direction X and disposedadjacent to sides of the plurality of active columns 401. It should benoted that the plurality of word lines 601 may be attached only to sidesof the plurality of active columns 401 parallel to the direction X.Specifically, one of the plurality of word lines 601 may include a wordline insulating layer 603 and a word line conductive layer 605.

With reference to FIGS. 1 and 4, in the embodiment depicted, the wordline insulating layer 603 may extend in the direction X. The word lineinsulating layer 603 may be attached to the sides, parallel to thedirection X, of the active column 401. A top surface of the word lineinsulating layer 603 may be at a same vertical level as the top surface407-1 of the top doped region 407. A bottom of the word line insulatinglayer 603 may be at a vertical level lower than the vertical level ofthe top surface of the bottom doped region 403. Specifically, the wordline insulating layer 603 may include a vertical portion and ahorizontal portion. The vertical portion may be attached to the sides ofthe active column 401. One end of the horizontal portion may connect toa bottom of the vertical portion. An opposite end of the horizontalportion may connect to a bottom of an adjacent vertical portion whichmay be attached to a side of an adjacent active column 401. The wordline insulating layer 603 may be formed of, for example, an insulatingmaterial having a dielectric constant of about 4.0 or greater.Alternatively, in another embodiment, the insulating material may besilicon oxide, silicon nitride, silicon oxynitride, silicon nitrideoxide, or the like.

With reference to FIGS. 1 and 4, in the embodiment depicted, the wordline conductive layer 605 may be attached to the word line insulatinglayer 603. Specifically, the word line conductive layer 605 may beattached to the vertical portion of the word line insulating layer 603and disposed on the horizontal portion of the word line insulating layer603. A top surface of the word line conductive layer 605 may be at avertical level higher than a top surface of the channel region 405. Abottom of the word line conductive layer 605 may be at a vertical levellower than the vertical level of the top surface of the bottom dopedregion 403. The word line conductive layer 605 may be formed of, forexample, a conductive material such as polysilicon, silicon germanium,metal, metal alloy, metal silicide, metal nitride, or metal carbide. Themetal may be aluminum, copper, tungsten, or cobalt. The metal silicidemay be nickel silicide, platinum silicide, titanium silicide, molybdenumsilicide, cobalt silicide, tantalum silicide, tungsten silicide, or thelike.

With reference to FIGS. 1 and 4, in the embodiment depicted, the thirdinsulating layer 705 may extend in the direction X. The third insulatinglayer 705 may be disposed between adjacent pairs of the plurality ofactive columns 401. That is, the adjacent pairs of the plurality ofactive columns 401 may be electrically isolated by the third insulatinglayer 705. The third insulating layer 705 may be disposed adjacent tothe word line insulating layer 603 and the word line conductive layer605. Specifically, the third insulating layer 705 may be disposedbetween adjacent pairs of the word line conductive layers 605. A topsurface of the third insulating layer 705 may be at a same verticallevel as the top surface of the first insulating layer 701. The thirdinsulating layer 705 may be formed of a same material as the firstinsulating layer 701, but is not limited thereto.

With reference to FIGS. 1 to 4, in the embodiment depicted, the fourthinsulating layer 707 may be disposed on the first insulating layer 701,the second insulating layer 703, and the third insulating layer 705. Thefourth insulating layer 707 may be formed of a same material as thefirst insulating layer 701, but is not limited thereto. The plurality ofbit line contacts 709 may be disposed in the fourth insulating layer707. The plurality of bit line contacts 709 may be disposed on theplurality of bit lines 501. Specifically, with reference to FIG. 2, oneof the plurality of bit line contacts 709 may be disposed on topsurfaces of two extending portions 505 of an adjacent pair of theplurality of bit lines 501 attached to both sides of an active column401. The plurality of bit line contacts 709 may be disposed on the topsurface 407-1 of the top doped region 407. With reference to FIG. 3, thecapacitor contact 711 may be disposed on the top doped region 407 and onthe pair of insulating spacers 409. The plurality of bit line contacts709 and the capacitor contact 711 may be formed of, for example,titanium, titanium nitride, tungsten, or tungsten nitride.

FIG. 5 is a schematic cross-sectional view diagram taken along the lineA-A′ in FIG. 1 illustrating a semiconductor device 100B in accordancewith another embodiment of the present disclosure. FIG. 6 is a schematiccross-sectional view diagram taken along the line C-C′ in FIG. 1illustrating the semiconductor device 100B in accordance with anotherembodiment of the present disclosure.

With reference to FIGS. 5 and 6, the semiconductor device 100B mayinclude a plurality of air gaps 731. The plurality of air gaps 731 maybe disposed in the second insulating layer 703 and the third insulatinglayer 705. In other words, the plurality of air gaps 731 may be disposedbetween adjacent pairs of active columns 401 disposed along thedirection X and the direction Y. Because the plurality of air gaps 731are filled with air, a dielectric constant of the plurality of air gaps731 may be significantly lower than the insulating layers formed of, forexample, silicon oxide. Therefore, the plurality of air gaps 731 maysignificantly reduce the parasitic capacitance between adjacent activecolumns 401 or between adjacent bit lines 501. That is, the plurality ofair gaps 731 may significantly alleviate an interference effect betweenelectrical signals induced or applied to the bit line 501 or the activecolumn 401.

FIG. 7 is a schematic cross-sectional view diagram taken along the lineA-A′ in FIG. 1 illustrating a semiconductor device 100C in accordancewith another embodiment of the present disclosure.

With reference to FIG. 7, the semiconductor device 100C may include aplurality of epitaxial units 733. The plurality of epitaxial units 733may be respectively correspondingly disposed on the plurality of topdoped regions 407. The plurality of epitaxial units 733 may be formedof, for example, silicon carbide. The presence of the plurality ofepitaxial units 733 may improve a carrier mobility of the semiconductordevice 100C.

It should be noted that the terms “forming,” “formed” and “form” maymean and include any method of creating, building, patterning,implanting, or depositing an element, a dopant or a material. Examplesof forming methods may include, but are not limited to, atomic layerdeposition, chemical vapor deposition, physical vapor deposition,sputtering, co-sputtering, spin coating, diffusing, depositing, growing,implantation, photolithography, dry etching, and wet etching.

FIG. 8 illustrates, in a flowchart diagram form, a method 30 forfabricating a semiconductor device 100A in accordance with oneembodiment of the present disclosure. FIG. 9 illustrates, in a schematictop-view diagram, an intermediate semiconductor device in accordancewith one embodiment of the present disclosure. FIGS. 10 to 18 areschematic cross-sectional view diagrams taken along the line A-A′ inFIG. 9 illustrating part of a flow for fabricating the semiconductordevice 100A in accordance with one embodiment of the present disclosure.

With reference to FIGS. 8 to 10, at step S11, in the embodimentdepicted, a substrate 101 may be provided, an isolation layer 103 may beformed in the substrate 101, and a first gate stack 201 and a secondgate stack 301 may be formed on the substrate 101. The substrate 101 mayinclude a center area 10 and a peripheral area 20 surrounding the centerarea 10. The isolation layer 103 may define a first active area 105 anda second active area 107 in the peripheral area 20. The first gate stack201 may be formed on the peripheral area 20 and include, from bottom totop, a first gate insulating layer 203, a first gate bottom conductivelayer 205, a first gate filler layer 207, and a first gate mask layer209. The second gate stack 301 may be formed on the peripheral area 20and next to the first gate stack 201. The second gate stack 301 mayinclude, from bottom to top, a second gate insulating layer 303, asecond gate bottom conductive layer 305, a second gate top conductivelayer 307, a second gate filler layer 309, and a second gate mask layer311. A top surface 209-1 of the first gate mask layer 209 may be at asame vertical level as a top surface 311-1 of the second gate mask layer311.

With reference to FIGS. 8 and 11 to 13, at step S13, in the embodimentdepicted, a pair of first gate spacers 211 and a pair of second gatespacers 313 may be formed on the peripheral area 20 of the substrate101, and a pair of first gate lightly-doped regions 213, a pair ofsecond gate lightly-doped regions 315, a pair of first gateheavily-doped regions 215, a pair of second gate heavily-doped regions317, and a bottom doped area 719 may be formed in the peripheral area 20of the substrate 101. With reference to FIG. 11, the pair of first gatelightly-doped regions 213 and the pair of second gate lightly-dopedregions 315 may be sequentially respectively formed in the first activearea 105 and the second active area 107 by implantation processes. Thepair of first gate spacers 211 and the pair of second gate spacers 313may be respectively correspondingly formed attached to sides of thefirst gate stack 201 and the second gate stack 301.

With reference to FIG. 12, a first mask layer 801 may be patterned tocover the center area 10 and the first active area 105. The pair ofsecond gate heavily-doped regions 317 may be formed in the second activearea 107 by a first implantation process using a dopant such as boron.After the first implantation process, the first mask layer 801 may beremoved. With reference to FIG. 13, a second mask layer 803 may bepatterned to cover the second active area 107. A second implantationprocess may be performed to form the pair of first gate heavily-dopedregions 215 in the first active area 105 and the bottom doped area 719in the center area 10. With reference to FIGS. 8 and 14 to 20, at stepS15, in the embodiment depicted, a plurality of active columns 401 maybe formed in the center area 10 of the substrate 101. With reference toFIG. 14, a first insulating layer 701 and a first hard mask film 813 maybe sequentially formed on the substrate 101. The first insulating layer701 may cover the first gate stack 201 and the second gate stack 301.The first hard mask film 813 may be formed of, for example, siliconnitride, or silicon nitride oxide. A third mask layer 805 may bepatterned to define positions of the plurality of active columns 401 onthe first hard mask film 813. With reference to FIG. 15, an etchprocess, such as an anisotropic dry etch process, may be performed toform a plurality of first trenches 725 in the center area 10. Portionsof top surfaces of the bottom doped area 719 may be exposed through theplurality of first trenches 725.

With reference to FIG. 16, a conductive material such as doped siliconmay be deposited in the plurality of first trenches 725. A planarizationprocess, such as chemical mechanical polishing, may be performed untilthe first hard mask film 813 is exposed. An etch-back process may beperformed to recess the conductive material in the plurality of firsttrenches 725 and form the channel regions 405. Alternatively, in anotherembodiment, the channel regions 405 may be formed by an epitaxy processwith in-situ doping. With reference to FIG. 17, top doped regions 407may be formed by a procedure similar to that illustrated in FIG. 16. Inthe current stage, top surfaces of the top doped regions 407 may be at asame vertical level as a top surface of the first hard mask film 813.

With reference to FIG. 18, a second hard mask film 815 may be depositedon the first hard mask film 813. The second hard mask film 815 may beformed of a same material as the first hard mask film 813, but is notlimited thereto. A fourth mask layer 807 may be patterned to definepositions of a plurality of second trenches 727 on the second hard maskfilm 815. With reference to FIGS. 19 and 20, an etch process, such as ananisotropic dry etch process, may be performed to form the plurality ofsecond trenches 727 penetrating the second hard mask film 815, the firsthard mask film 813, the first insulating layer 701, and upper portionsof the bottom doped area 719. Sidewalls of the top doped regions 407,sidewalls of the channel regions 405, and sidewalls of the upperportions of the bottom doped area 719 may be exposed through theplurality of second trenches 727. The top doped regions 407, the channelregions 405, and portions of the bottom doped area 719 together form theplurality of active columns 401. In the current stage, the plurality ofactive columns 401 may be rectangular from a top-view perspective andmay extend in the direction Y.

FIG. 19 illustrates, in a schematic top-view diagram, an intermediatesemiconductor device in accordance with one embodiment of the presentdisclosure. FIGS. 20 to 25 are schematic cross-sectional view diagramstaken along a line A-A′ in FIG. 19 illustrating part of the flow forfabricating the semiconductor device 100A in accordance with oneembodiment of the present disclosure.

With reference to FIGS. 8 and 21 to 34, at step S17, in the embodimentdepicted, a plurality of bit lines 501 may be formed adjacent to theplurality of active columns 401. With reference to FIG. 21, a layer ofinsulating material may be formed to cover the plurality of secondtrenches 727. Subsequently, an etch process, such as an anisotropic dryetch process, may be performed to remove portions of the layer ofinsulating material and form pairs of insulating spacers 409respectively correspondingly attached to sides of the plurality ofactive columns 401. In the current stage, portions of top surfaces ofthe bottom doped area 719 may still be exposed through the plurality ofsecond trenches 727.

With reference to FIG. 22, a wet bottle etch process may be performed toform recessed portions 727-1 in the bottom doped area 719. Portions ofthe bottom doped area 719 may be exposed through the recessed portions727-1. With reference to FIG. 23, a silicidation process may beperformed to form adhesion layers 507 on the exposed portions of thebottom doped area 719. With reference to FIG. 24, a bit line conductivematerial 713 may be deposited to cover sidewalls of the plurality ofsecond trenches 727, sidewalls and bottoms of the recessed portions727-1, and top surfaces of the second hard mask film 815. The bit lineconductive material 713 may be formed of, for example, tungsten,aluminum, copper, nickel, or cobalt.

With reference to FIG. 25, an etch process, such as an anisotropic dryetch process, may be performed to remove portions of the bit lineconductive material 713 and deepen the bottoms of the recessed portions727-1. After the etch process, connection portions 503 and extendingportions 505 may be concurrently formed. The bottoms of the recessedportions 727-1 may be etched to a vertical level lower than a verticallevel of a bottom of the bottom doped area 719, and the bottom dopedarea 719 may be turned into bottom doped regions 403. The connectionportions 503 may be respectively correspondingly formed adjacent to theadhesion layers 507. Bottoms of the extending portions 505 may berespectively correspondingly formed so as to be connected to upperportions of the connection portions 503. The extending portions 505 maybe respectively correspondingly formed so as to be attached to sidewallsof the pairs of insulating spacers 409. Top surfaces of the extendingportions 505 may be recessed to a vertical level lower than a verticallevel of the top surface of the first insulating layer 701. In thecurrent stage, the connection portions 503 and the extending portions505 may extend in the direction Y. Each of the connection portions 503may have two ends from a top-view perspective. Each of the extendingportions 505 may have two ends from a top-view perspective.

FIG. 26 illustrates, in a schematic top-view diagram, an intermediatesemiconductor device in accordance with one embodiment of the presentdisclosure. FIG. 27 is a schematic cross-sectional view diagram takenalong a line A-A′ in FIG. 26 illustrating part of the flow forfabricating the semiconductor device 100A in accordance with oneembodiment of the present disclosure. FIG. 28 is a schematiccross-sectional view diagram taken along a line B-B′ in FIG. 26illustrating part of the flow for fabricating the semiconductor device100A in accordance with one embodiment of the present disclosure. FIG.29 is a schematic cross-sectional view diagram taken along the line A-A′in FIG. 26 illustrating part of the flow for fabricating thesemiconductor device 100A in accordance with one embodiment of thepresent disclosure. FIG. 30 is a schematic cross-sectional view diagramtaken along the line B-B′ in FIG. 26 illustrating part of the flow forfabricating the semiconductor device 100A in accordance with oneembodiment of the present disclosure.

With reference to FIGS. 26 to 28, a fifth mask layer 809 may be formedin the plurality of second trenches 727, in the recessed portions 727-1,and on top surfaces of the second hard mask film 815. As shown in FIG.27, the fifth mask layer 809 in a region of one end of the connectionportions 503 may be intact. That is, in the region of one end of theconnection portions 503, the connection portions 503 and the extendingportions 505 may both be still masked by the fifth mask layer 809. Incontrast, as shown in FIG. 28, the fifth mask layer 809 may be recessedso that only portions of the fifth mask layer 809 near the connectionportions 503 in the recessed portions 727-1 remain. That is, in regionsof the recessed fifth mask layer 809, the extending portions 505 may beexposed through the plurality of second trenches 727, and the connectionportions 503 may be still masked by the fifth mask layer 809. Withreference to FIGS. 29 and 30, an etch process, such as an anisotropicdry etch process, may be performed to remove the exposed extendingportions 505. After the etch process, the fifth mask layer 809 may beremoved.

FIG. 31 is a schematic cross-sectional view diagram taken along the lineA-A′ in FIG. 26 illustrating part of the flow for fabricating thesemiconductor device 100A in accordance with one embodiment of thepresent disclosure. FIG. 32 is a schematic cross-sectional view diagramtaken along the line B-B′ in FIG. 26 illustrating part of the flow forfabricating the semiconductor device 100A in accordance with oneembodiment of the present disclosure. FIG. 33 is a schematiccross-sectional view diagram taken along the line A-A′ in FIG. 26illustrating part of the flow for fabricating the semiconductor device100A in accordance with one embodiment of the present disclosure. FIG.34 is a schematic cross-sectional view diagram taken along the line B-B′in FIG. 26 illustrating part of the flow for fabricating thesemiconductor device 100A in accordance with one embodiment of thepresent disclosure.

With reference to FIGS. 31 and 32, a first insulating material 721 maybe formed in the plurality of second trenches 727, in the recessedportions 727-1, and on the top surface of the second hard mask film 815.The first insulating material may be formed of a same material as thefirst insulating layer 701, but is not limited thereto. With referenceto FIGS. 33 and 34, a planarization process, such as chemical mechanicalpolishing, may be performed until the top surface 209-1 of the firstgate mask layer 209 and the top surface 311-1 of the second gate masklayer 311 are exposed. After the planarization process, the firstinsulating material 721 may be turned into the second insulating layer703 and a substantially flat surface for subsequent processing steps maybe formed. In the current stage, the top surface 407-1 of the top dopedregion 407 may be at a same vertical level as the top surface 209-1 ofthe first gate mask layer 209 and the top surface 311-1 of the secondgate mask layer 311.

FIG. 35 illustrates, in a schematic top-view diagram, an intermediatesemiconductor device in accordance with one embodiment of the presentdisclosure. FIGS. 36 and 37 are schematic cross-sectional view diagramstaken along a line A-A′ in FIG. 35 illustrating part of the flow forfabricating the semiconductor device 100A in accordance with oneembodiment of the present disclosure.

With reference to FIGS. 8 and 35 to 40, at step S19, in the embodimentdepicted, a plurality of word lines 601 may be formed adjacent to theplurality of active columns 401. With reference to FIGS. 35 and 36, athird hard mask film 817 may be formed on the second insulating layer703 and the top doped region 407. A sixth mask layer 811 may bepatterned to define positions of a plurality of third trenches 729. Thesixth mask layer 811 may comprise bars having a rectangular shape andextending in the X direction from a top-view perspective.

With reference to FIG. 37, an etch process, such as an anisotropic dryetch process, may be performed to form the plurality of third trenches729 penetrating the third hard mask film 817, the top doped region 407,the channel region 405, and upper portions of the bottom doped region403. In other words, bottoms of the plurality of third trenches 729 maybe at a vertical level lower than a vertical level of the top surfacesof the bottom doped region 403. A word line insulating material 715 anda word line conductive material 717 may be sequentially formed in theplurality of third trenches 729. The word line insulating material 715may be formed of, for example, an insulating material having adielectric constant of about 4.0 or greater. The word line conductivematerial 717 may be formed of a conductive material such as polysilicon,silicon germanium, metal, metal alloy, metal silicide, metal nitride, ormetal carbide.

FIG. 38 illustrates, in a schematic top-view diagram, an intermediatesemiconductor device in accordance with one embodiment of the presentdisclosure. FIGS. 39 and 40 are schematic cross-sectional view diagramstaken along a line A-A′ in FIG. 38 illustrating part of the flow forfabricating the semiconductor device 100A in accordance with oneembodiment of the present disclosure.

With reference to FIGS. 38 and 39, an etch process, such as ananisotropic dry etch process, may be performed to remove a portion ofthe word line conductive material 717 and turn the word line conductivematerial 717 into word line conductive layers 605. The word lineconductive layers 605 may extend in the direction X. Top surfaces of theword line conductive layers 605 may be at a vertical level lower thanthe vertical level of the top surface 407-1 of the top doped region 407.Bottoms of the word line conductive layers 605 may be at a verticallevel lower than the vertical level of the top surfaces of the bottomdoped regions 403. Subsequently, a second insulating material 723 may beformed to cover the plurality of third trenches 729. The secondinsulating material 723 may be formed of a same material as the firstinsulating layer 701, but is not limited thereto.

With reference to FIG. 40, a planarization process, such as chemicalmechanical polishing, may be performed until the top surface 407-1 ofthe top doped region 407 is exposed and a substantially flat surface forsubsequent processing steps is formed. After the planarization process,the word line insulating material 715 may be turned into the word lineinsulating layer 603, and the second insulating material 723 may beturned into the third insulating layer 705. The third insulating layer705 may be formed so as to extend in the direction X. The word lineinsulating layer 603 formed between adjacent active columns 401 may havea U-shaped profile from a cross-sectional perspective.

With reference back to FIGS. 1 to 4, at step S21, in the embodimentdepicted, a plurality of bit line contacts 709 and a plurality ofcapacitor contacts 711 may be formed above the substrate 101. A fourthinsulating layer 707 may be formed on the first insulating layer 701,the second insulating layer 703, the third insulating layer 705, and theplurality of active columns 401. The plurality of bit line contacts 709may be respectively correspondingly formed on the extending portions 505by a damascene process. The plurality of capacitor contacts 711 may beformed on the top doped region 407 by another damascene process.

Due to the design of the semiconductor device 100A of the presentdisclosure, the top surface 209-1 of the first gate mask layer 209, thetop surface 311-1 of the second gate mask layer 311, the top surface407-1 of the top doped region 407, the top surface of the firstinsulating layer 701, the top surface of the second insulating layer703, and the top surface of the third insulating layer 705 may be at thesame vertical level. In other words, top surfaces of the center area 10and the peripheral area 20 may be at the same vertical level. Thesemiconductor device 100A may have a substantially flat top surface tofacilitate performing of subsequent semiconductor processes on thesubstantially flat top surface. Therefore, the yield and quality of thesemiconductor device may be improved. In addition, the presence of theplurality of air gaps 731 may significantly alleviate an interferenceeffect originating from the parasitic capacitance.

Although the present disclosure and its advantages have been describedin detail, it should be understood that various changes, substitutionsand alterations can be made herein without departing from the spirit andscope of the disclosure as defined by the appended claims. For example,many of the processes discussed above can be implemented in differentmethodologies and replaced by other processes, or a combination thereof.

Moreover, the scope of the present application is not intended to belimited to the particular embodiments of the process, machine,manufacture, composition of matter, means, methods and steps describedin the specification. As one of ordinary skill in the art will readilyappreciate from the disclosure of the present disclosure, processes,machines, manufacture, compositions of matter, means, methods, or steps,presently existing or later to be developed, that perform substantiallythe same function or achieve substantially the same result as thecorresponding embodiments described herein, may be utilized according tothe present disclosure. Accordingly, the appended claims are intended toinclude within their scope such processes, machines, manufacture,compositions of matter, means, methods, and steps.

What is claimed is:
 1. A method for fabricating a semiconductor device,comprising: providing a substrate comprising a center area and aperipheral area surrounding the center area; forming a first gate stackon the peripheral area and having a top surface; and forming an activecolumn in the center area and having a top surface at a same verticallevel as the top surface of the first gate stack; wherein a top surfaceof the first gate stack and a top surface of the active column are at asame vertical level.
 2. The method for fabricating a semiconductordevice 1, wherein forming the active column comprises: forming a bottomdoped region in the center area, forming a channel region on the bottomdoped region, and forming a top doped region (on the channel region,wherein a bottom of the channel region is formed at a same verticallevel as a top surface of the substrate, and a top surface of the topdoped region is formed at a same vertical level as the top surface ofthe first gate stack.
 3. The method for fabricating a semiconductordevice 2, further comprising: forming a bit line comprising a connectionportion and an extending portion, wherein the connection portion extendsin a first direction and is adjacent to a side, parallel to the firstdirection, of the bottom doped region, wherein the extending portion isconnected to an end of the connection portion and extends in a seconddirection perpendicular to the first direction.
 4. The method forfabricating a semiconductor device 3, wherein a top surface of theextending portion is at a same vertical level as the top surface of thefirst gate stack.
 5. The method for fabricating a semiconductor device4, further comprising: forming an insulating spacer between theextending portion and the active column.
 6. The method for fabricating asemiconductor device 5, further comprising: forming an adhesion layerbetween the connection portion and the bottom doped region.
 7. Themethod for fabricating a semiconductor device 6, further comprising:forming a word line comprising a word line insulating layer and a wordline conductive layer both extending in a third direction perpendicularto the first direction and the second direction, wherein the word lineinsulating layer is attached to a side, which is parallel to the thirddirection, of the active column, and the word line conductive layer isattached to the word line insulating layer.
 8. The method forfabricating a semiconductor device 7, wherein a bottom of the word lineconductive layer is at a vertical level lower than the vertical level ofthe bottom of the channel region, and a top surface of the word lineconductive layer is at a vertical level higher than a vertical level ofa top surface of the channel region.
 9. The method for fabricating asemiconductor device 8, further comprising: forming a first insulatinglayer on the center area 10 and surrounding the first gate stack. 10.The method for fabricating a semiconductor device 9, further comprising:forming a second insulating layer arranged parallel to the firstdirection and adjacent to the plurality of bit lines, wherein a bottomof the second insulating layer is at a vertical level lower than avertical level of the bottom of the bottom doped region.
 11. The methodfor fabricating a semiconductor device 10, further comprising: forming athird insulating layer parallel to the third direction and adjacent tothe word line conductive layer.
 12. The method for fabricating asemiconductor device 11, further comprising: forming a bit line contacton the extending portion.
 13. The method for fabricating a semiconductordevice 12, further comprising: forming a capacitor contact on the topdoped region.
 14. The method for fabricating a semiconductor device 13,wherein the first gate stack comprises a first gate insulating layer onthe peripheral area 20, a first gate bottom conductive layer on thefirst gate insulating layer, a first gate filler layer on the first gatebottom conductive layer, and a first gate mask layer on the first gatefiller layer, wherein a top surface of the first gate mask layer is at asame vertical level as the top surface of the top doped region.
 15. Themethod for fabricating a semiconductor device 14, wherein the first gateinsulating layer has a thickness between about 0.5 nm and about 5.0 nm.16. The method for fabricating a semiconductor device 15, furthercomprising: forming a second gate stack on the peripheral area of thesubstrate, wherein a top surface of the second gate stack is at a samevertical level as the top surface of the first gate mask layer.
 17. Themethod for fabricating a semiconductor device 16, wherein the secondgate stack comprises a second gate insulating layer on the peripheralarea 20, a second gate bottom conductive layer on the second gateinsulating layer, a second gate top conductive layer on the second gatebottom conductive layer, a second gate filler layer on the second gatetop conductive layer, and a second gate mask layer on the second gatefiller layer, wherein a top surface of the second gate mask layer is ata same vertical level as the top surface of the top doped region. 18.The method for fabricating a semiconductor device 17, wherein thethickness of the first gate insulating layer is different from athickness of the second gate insulating layer.
 19. The method forfabricating a semiconductor device 17, wherein the first gate bottomconductive layer has a thickness between about 10 angstroms and about200 angstroms, and the first gate bottom conductive layer is formed ofaluminum, silver, titanium, titanium nitride, titanium aluminum,titanium carbide aluminum, titanium nitride aluminum, titanium siliconaluminum, tantalum nitride, tantalum carbide, tantalum silicon nitride,manganese, zirconium, or tungsten nitride.